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Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
Shichun Qu, Yong Liu
322 pages • hardcover
ISBN/UID: 9781493915552
Format: Hardcover
Language: English
Original Pub Year: Not specified
Edition Pub Date: 11 Sep 2014
Publisher: Springer
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Hardcover 322 pages
Format
Language
322 pages • paperback
ISBN/UID: 9781493954384
Format: Paperback
Edition Pub Date: 23 Aug 2016
Paperback 322 pages
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