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Book Information
322 pages • paperback • 2 editions
ISBN/UID: 9781493954384
Format: Paperback
Language: English
Publisher: Springer
Edition Pub Date: 23 Aug 2016
Description
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging a...
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Content Warnings
322 pages • paperback
ISBN/UID: 9781493954384
Format: Paperback
Language: English
Publisher: Springer
Edition Pub Date: 23 Aug 2016
Description
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging a...
Community Reviews
Content Warnings