Editions

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Current edition
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages by Gerard Kelly

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Gerard Kelly

134 pages

nonfiction art technology informative medium-paced
Other editions (1)
Expand filter menu Filter editions
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages by Gerard Kelly

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Gerard Kelly

134 pages

nonfiction art technology informative medium-paced